» When to use 3D Die-Stacked Memory for Bandwidth-Constrained Big Data Workloads

| Sorted by Date | Classified by Faculty |

Jason Lowe-Power, Mark D. Hill, and David A. Wood. When to use 3D Die-Stacked Memory for Bandwidth-Constrained Big Data Workloads. CoRR, abs/1608.07485, 2016.

Download

(unavailable)

Abstract

(unavailable)

BibTeX

 @article{DBLP:journals/corr/Lowe-PowerHW16,
   author    = {Jason Lowe{-}Power and
                Mark D. Hill and
                David A. Wood},
   title     = {When to use 3D Die-Stacked Memory for Bandwidth-Constrained Big Data
                Workloads},
   journal   = {CoRR},
   volume    = {abs/1608.07485},
   year      = {2016},
   url       = {http://arxiv.org/abs/1608.07485},
   eprinttype = {arXiv},
   eprint    = {1608.07485},
   timestamp = {Mon, 25 Mar 2019 00:00:00 +0100},
   biburl    = {https://dblp.org/rec/journals/corr/Lowe-PowerHW16.bib},
   bibsource = {dblp computer science bibliography, https://dblp.org}
 }

---

Generated by bib.pl (written by Patrick Riley ) on Mon Sep 27, 2021 15:47:03 time=1207019082